System and method for data center heat containment

ABSTRACT

The disclosed system may include a group of information technology racks, where (1) each of the information technology racks stores information technology device modules, (2) the group of information technology racks are arranged such that interior faces of the information technology racks define a vertical column of space enclosed by the group of information technology racks, and (3) the information technology racks ventilate air heated by the information technology device modules from the interior faces of the information technology racks into the vertical column of space such that the heated air is contained within the vertical column of space.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority under 35U.S.C. § 120 to U.S. application Ser. No. 15/729,188, filed on Oct. 10,2017, and entitled “SYSTEM AND METHOD FOR DATA CENTER HEAT CONTAINMENT”,the contents of which are hereby incorporated by reference.

BACKGROUND

Demand for computational resources from organizations and individualscontinues to grow. Increasingly, data centers meet this demand byproviding large amounts of data processing and data storage capacity ina concentrated physical space. Some data centers may provide computingas a service, giving customers the flexibility to consume computationalresources on an as-needed basis while sparing the customers thefinancial and administrative burdens of maintaining the underlyingphysical computing infrastructure. Other data centers may providelarge-scale computation for a single organization. In either case, theoptimization of data centers becomes increasingly central to computationas data centers grow and proliferate.

Optimizing data centers involves many factors that interrelate incomplex ways. For example, computing devices generate waste heat, whichmay interfere with device performance or reliability. However, dispersalof waste heat from one device may interfere with the operation of otherdevices in the same data center. In addition, waste heat may make a datacenter environment unsuitable for human presence, thereby potentiallyinterfering with the work of data center technicians and administrators.Furthermore, cooling systems may impose significant operating costs inthe form of energy consumption, as well as costs for acquisition andmaintenance.

Traditional data center layouts may place data center equipment in longrows. Unfortunately, disposing of long aisles of waste heat generated inthis arrangement may pose significant ongoing expenses for energy andequipment. In some cases, traditional approaches may involve buildingseparate walled-off areas to house some heat-producing devices, posingincreased construction costs, requiring increased physical plantfootprint, and/or potentially undermining other data center layoutcriteria (e.g., accessibility, compact infrastructure, and/or optimizingdevice placement for efficient communication).

Due to the many tradeoffs involved in data center designs and the highlycommoditized nature of computing, an improvement to data center designcan unlock a tremendous amount of value for data center operators andconsumers.

SUMMARY

As will be described in greater detail below, the instant disclosuregenerally relates to apparatuses, systems, and methods for data centerheat containment. In one example, a data center heat containment systemmay include a group of information technology racks, where (1) each ofthe information technology racks stores information technology devicemodules, (2) the group of information technology racks are arranged suchthat interior faces of the information technology racks define avertical column of space enclosed by the group of information technologyracks, and (3) the information technology racks ventilate air heated bythe information technology device modules from the interior faces of theinformation technology racks into the vertical column of space such thatthe heated air is contained within the vertical column of space.

In some examples, the base of the vertical column of space defined bythe interior faces of the group of information technology racks mayapproximate a circle. For example, the base of the vertical column ofspace may approximate a regular polygon (which, in turn, may approximatea circle).

In some embodiments, the interior faces of the group of informationtechnology racks may extend perpendicularly from the base of the groupof information technology racks. Alternatively, the interior faces ofthe group of information technology racks may extend obliquely away fromthe center of the group of information technology racks such that thevertical column of space defined by the interior faces of theinformation technology racks expands as the vertical distance from thebase of the information technology racks increases.

In some examples, the information technology racks may take in air fromthe exterior faces of the information technology racks that is coolerthan the heated air. In some embodiments, the information technologyracks may extend from the floor to the ceiling such that the verticalcolumn of space defined by the plurality of information technology racksis enclosed by the floor and the ceiling.

According to some embodiments, the system may also include an air flowapparatus adapted to move the heated air upward within the verticalcolumn of space. The air flow apparatus may include any of a variety ofelements. In some examples, the air flow apparatus may include a fanbelow the vertical column of space that blows the heated air upwardand/or a fan above the vertical column of space that pulls the heatedair upward. Additionally or alternatively, the air flow apparatus mayinclude multiple fans positioned to create a vortex with an updraftwithin the vertical column of space. In some examples, the air flowapparatus may include a conical surface pointing upward within thevertical column of space. In some embodiments, the air flow apparatusmay include a liquid cooling pipe that transports heat away from thegroup of information technology racks and that extends verticallythrough the vertical column of space. In some examples, the informationtechnology device modules may ventilate the heated air upward from theinterior faces of the group of information technology racks.

In some examples, the system may also include a gantry robot that ispositioned within the vertical column of space and is adapted to insertand to remove one or more of the information technology device modulesfrom one or more of the information technology racks.

The gantry robot may take any suitable form. In some examples, thegantry robot may be adapted to move a sliding element parallel to theface of an information technology rack, where the face of theinformation technology rack exposes information technology devicemodules that are stored by the information technology rack and thatthereby connect to and operate within a computing infrastructure. Insome examples, the gantry robot may include (1) a track that is coupledto the sliding element and that extends away from the sliding elementand toward the face of the information technology rack and (2) anengaging element that is adapted to move along the track and to engagewith one or more of the plurality of information technology devicemodules stored by the information technology rack, such that theengaging element is adapted to insert into the information technologyrack and remove from the information technology rack one or more of theplurality of information technology device modules. In some examples,the system may also include a floor track along which the gantry robotis adapted to travel from a position in front of an interior face of afirst information technology rack to a position in front of an interiorface of a second information technology rack.

In some embodiments, the gantry robot may be adapted to swivel around anaxis rising along the vertical column of space. In these embodiments,the gantry robot may engage with a selected information technology rackwithin the group of information technology racks by first swiveling toface the selected information technology rack.

In addition to the various systems described herein, the instantdisclosure presents, by way of example, methods associated with datacenter heat containment. For example, a method may include positioning aplurality of information technology racks, such that (1) each rackwithin the group of information technology racks stores informationtechnology device modules, (2) interior faces of the plurality ofinformation technology racks define a vertical column of space enclosedby the plurality of information technology racks, and (3) the group ofinformation technology racks ventilate air heated by the informationtechnology device modules from the interior faces of the group ofinformation technology racks into the vertical column of space such thatthe heated air is contained within the vertical column of space. In someexamples, the base of the vertical column of space defined by theinterior faces of the plurality of information technology racks mayapproximate a circle.

Features from any of the above-mentioned embodiments may be used incombination with one another in accordance with the general principlesdescribed herein. These and other embodiments, features, and advantageswill be more fully understood upon reading the following detaileddescription in conjunction with the accompanying drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings illustrate a number of exemplary embodimentsand are a part of the specification. Together with the followingdescription, these drawings demonstrate and explain various principlesof the instant disclosure.

FIG. 1 is a perspective view of an information technology rack.

FIG. 2 is a perspective view a system of information technology racks.

FIG. 3 is a top view of a system of information technology racks.

FIG. 4 is a perspective view of a system of information technologyracks.

FIG. 5 is a top view of a system of information technology racks.

FIG. 6 is a top view of a system of information technology racks with afan.

FIG. 7 is a top view of a system of information technology racks withfans.

FIG. 8 is a perspective view of an interior space of a system ofinformation technology racks with a cone.

FIG. 9 is a perspective view of an interior space of a system ofinformation technology racks with a liquid cooling pipe.

FIG. 10 is a perspective view of a gantry robot.

FIG. 11 is a perspective view of an underside of a tray for a gantryrobot.

FIG. 12 is a perspective view of an information technology rack with agantry robot.

FIG. 13 is a perspective view of an interior space of a system ofinformation technology racks with a gantry robot on tracks.

FIG. 14 is a top view of a system of information technology racks with agantry robot on tracks.

FIG. 15 is a perspective view of a gantry robot.

FIG. 16 is a top view of a system of information technology racks with agantry robot.

Throughout the drawings, identical reference characters and descriptionsindicate similar, but not necessarily identical, elements. While theexemplary embodiments described herein are susceptible to variousmodifications and alternative forms, specific embodiments have beenshown by way of example in the drawings and will be described in detailherein. However, the exemplary embodiments described herein are notintended to be limited to the particular forms disclosed. Rather, theinstant disclosure covers all modifications, equivalents, andalternatives falling within the scope of the appended claims.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The present disclosure describes various apparatuses, systems, andmethods for data center heat containment. These heat containment systemsmay use data center racks themselves as walls to contain (e.g., fullysurround) air heated by the devices operating within the data centerracks. By placing data center racks to create complete (or nearlycomplete) enclosures and orienting the data center racks (and deviceswithin the data center racks) to ventilate heated air into theenclosures, the systems and methods described herein may efficiently andeffectively separate heated air from cool air within data centers,thereby potentially reducing cooling equipment and energy costs. Inaddition, by creating complete enclosures from data center racksthemselves, these systems and methods may avoid costs that wouldotherwise be incurred by constructing separate walls, rooms, and/orextensions to contain heated air. In some examples, by arranging datacenter racks to create approximately circular enclosures, these systemsand methods may reduce diffusion of heat from the enclosures to theouter environment and/or may improve air flow dynamics to quickly moveheated air toward an air return with little additional energy input.Additionally or alternatively, one or more air flow apparatusesoperating in connection with the data center racks may improve air flowdynamics to facilitate hot air return.

In some examples, the systems described herein may include gantry robotspositioned within the data center rack enclosures that may accessdevices that may otherwise be inconvenient to access for a human (e.g.,due to the heat within the enclosure and/or due to the inconvenience fora human entering or exiting the enclosure and/or the undesirability ofopening or closing the enclosure due to potential efficiency loss). Inaddition, such gantry robots may potentially perform device deploymentand/or maintenance tasks more responsively and/or efficiently than woulda human technician, thereby potentially improving data centerperformance.

The following will provide, with reference to FIGS. 1-5, examples ofsystems for data center heat containment. In addition, the discussionassociated with FIGS. 6-9 will provide examples of systems for managingcontained heated air in data centers with information technology racksystems. Finally, the discussion corresponding to FIGS. 10-16 willprovide examples of systems for interacting with data center deviceswithin heat containment enclosures.

FIG. 1 shows an information technology rack 100 that stores informationtechnology device modules (in a grid formation). As used herein, theterm “information technology rack” may refer to any structure forhousing multiple information technology device modules. In someexamples, an information technology rack may also house and/or providesupport for one or more cables that connect to information technologydevice modules. In some examples, an information technology rack mayhouse information technology device modules in a grid pattern (e.g.,shown in FIG. 1 on a face 110 of information technology rack 100). Aswill be explained in greater detail below, multiple instances ofinformation technology rack 100 may be deployed to create a heatcontainment system.

As used herein, the term “information technology device module” mayrefer to any modular device that may include and/or form a part of acomputing system and/or an information technology rack. Examples ofinformation technology device modules include, without limitation,servers, power supplies or other forms of power modules, networkswitches, and battery backup units. In some examples, a heterogeneousset of information technology device modules may operate within a singleinformation technology rack. For example, a single informationtechnology rack may connect servers, power supplies, network switches,and battery backup units within a computing infrastructure. Aninformation technology rack may connect information technology devicemodules to a computing infrastructure in any suitable manner. Forexample, an information technology rack may include one or more cablesand/or connectors that connect to stored information technology devicemodules and that transmit data and/or power between informationtechnology device modules and/or between an information technologydevice module and another system.

FIGS. 2-3 show a heat containment system 200. As shown in FIG. 2, heatcontainment system 200 may include a group of information technologyracks-namely, racks 210, 212, 214, 216, 218, and 220 (e.g., representinginstances of information technology rack 100). Each rack may storeinformation technology device modules. Information technology racks 210,212, 214, 216, 218, and 220 may be arranged such that the interior facesof the racks define a vertical column of space enclosed by the racks.Information technology racks 210, 212, 214, 216, 218, and 220 mayventilate air heated by the information technology device modules thatthey store from the interior faces of the racks into the vertical columnof space defined by the racks such that the heated air is containedwithin the vertical column of space. For example, as shown in FIG. 3,racks 210, 212, 214, 216, 218, and 220 may define a space 310 into whichheated air from the information technology device modules stored by theracks may ventilate. Space 310 may be enclosed by racks 210, 212, 214,216, 218, and 220 and thereby physically separated by the racks from aspace 320 surrounding the exterior faces of racks 210, 212, 214, 216,218, and 220.

The heat containment system may enclose a space approximating anysuitable shape. For example, as shown in FIG. 3, a base 302 of thevertical column of space defined by the interior faces of heatcontainment system 200 may approximate a hexagon. As will be explainedin greater detail below, the interior faces of the heat containmentsystem may define any other suitable shape for containing heated air(e.g., a square, a triangle, a rectangle, etc.).

The vertical column of space may encompass any suitable volume. In someexamples, the information technology racks may be 40 feet tall, 80 feettall, or taller. Thus, the vertical column of space may include a largevolume of air.

As another example, FIGS. 4 and 5 illustrate a heat containment system400. As shown in FIGS. 4 and 5, heat containment system 400 may includetwelve information technology racks. As illustrated in FIG. 5, thetwelve information technology racks may collectively define an enclosedvolume of space 510 into which heated air may be ventilated and whichmay be separated from an exterior space 520 by the twelve informationtechnology racks. A base 502 of the volume of space 510 may approximatea dodecahedron. As shown in FIG. 4, the enclosure created by the twelveinformation technology racks may not be complete. For example, a gap 410defined by one of the twelve information technology racks and anunderlying floor may permit objects (e.g., information technology devicemodules) to pass in and out of the enclosure. However, as will bediscussed in greater detail below, in various examples the enclosuredefined by the group of information technology device racks that form aheat containment system may be approximately complete.

In various examples, the heat containment systems described herein mayallow passage of objects (e.g., information technology device modulesand/or robots for installing and/or removing information technologydevice modules) and/or people into and/or out of the enclosures definedby the heat containment systems. For example, as discussed above, gap410 may allow one or more information technology device modules to passinto and/or out of heat containment system 400. In some examples, gap410 may be fitted with a door that may be closed to contain heat withinheat containment system 400 when no objects are being passed into or outof heat containment system 400. In some examples, a conveyor system maycarry information technology device modules via gap 410 into and/or outof heat containment system 400. For example, a robot may retrieveinformation technology device modules from the conveyor system forinstallation into the information technology racks and/or may placeinformation technology device modules removed from the informationtechnology racks on the conveyor system to be carried out of the heatcontainment system for disposal, for repairs, or for installation in aninformation technology rack that is not a part of the heat containmentsystem.

In some examples, one of the information technology racks forming a heatcontainment system may act as a portal between the inside and theoutside of the heat containment system. For example, the informationtechnology rack may be adapted to swing on hinges (e.g., acting as adoor), temporarily allowing the ingress and egress of people and/ordevices. In some examples, the information technology rack may beinstalled on vertical rails along which the information technology rackmay slide (e.g., upward off the floor or downward through an aperture inthe floor), temporarily allowing the ingress and egress of people and/ordevices. In some examples, a hatch within the heat containment systemmay allow the ingress and egress of people and/or devices.

While FIGS. 2-3 illustrate a hexagonal configuration and FIGS. 4-5illustrate a dodecagonal configuration, other configurations arepossible. In some examples, the base of the interior of the heatcontainment system may take the form of any substantially closed figure(e.g., symmetric or asymmetric). In some examples, the base of theinterior of the heat containment system may define a convex figure. Insome examples, the base of the interior of the heat containment systemmay approximate a regular polygon (e.g., the hexagon of FIGS. 2-3, thedodecagon of FIGS. 4-5, an icosagon, etc.). In some embodiments, thebase of the interior of the heat containment system may approximate acircle. For example, the heat containment system may approximate acircular configuration by approximating a regular polygon. As may beappreciated, regular polygons with a greater number of sides may moreeffectively approximate a circle. The heat containment system mayapproximate a circular configuration to any suitable degree according toany suitable metric. For example, the heat containment system mayapproximate a circular configuration according to the isoperimetricquotient of the base of the interior of the heat containment system. Theheat containment system may achieve roundness according to theisoperimetric quotient to any suitable degree, including, e.g., 0.8 orgreater, 0.85 or greater, 0.9 or greater, 0.95 or greater, 0.975 orgreater, or 0.99 or greater. The approximate roundness of the heatcontainment system may provide various advantages. For example, anapproximately round enclosure may minimize a surface-area-to-volumeratio of the enclosure, thereby potentially reducing dissipation of heatout of the enclosure. In addition, as will be explained in greaterdetail below, systems described herein may facilitate the movement ofthe heated air within the enclosure to an air return. In some examples,an approximately circular enclosure may facilitate such movement (e.g.,by facilitating the creation of a vortex with an updraft).

While FIGS. 2-5 illustrate the interior faces of the informationtechnology racks extending perpendicularly from the base of theplurality of information technology racks, in some examples the interiorfaces of the information technology racks may extend upward at a bias.For example, the interior faces of the group of information technologyracks may extend obliquely away from a center of the group ofinformation technology racks such that the vertical column of spacedefined by the interior faces of the groups of information technologyracks expands as a vertical distance from the base of the group ofinformation technology racks increases. The bias of the interior facesof the information technology racks may be achieved in any suitablemanner. In some examples, opposite pairs of the information technologyracks may be canted to form an approximate V shape when viewed from theside. In some examples, such an arrangement may facilitate favorableheat distribution and/or air flow within the enclosed space.

As shown in FIGS. 2-5, the information technology racks in heatcontainment systems 200 and 400 may provide complete or approximatelycomplete lateral enclosures for heated air (i.e., enclosing the verticalcolumn of space defined by the respective heat containment systems 200and 400 excepting for at the base and the top of the vertical column ofspace). By providing a complete or approximately complete enclosure,these systems may more effectively separate heated air from cooler air.In addition, by using the information technology racks themselves asphysical enclosure barriers, these systems may avoid the material andconstruction costs of creating separate enclosure barriers and mayreduce the physical footprint of the data center by reducing theconsumption of space within the data center by auxiliary materials.Accordingly, in some examples, substantially all lateral enclosuresurface of a heat containment system may be composed of informationtechnology racks (rather than, e.g., gaps in the surface and/or walls,doors, and/or other materials other than the information technologyracks themselves). For example, the lateral enclosure surface of a heatcontainment system (e.g., the enclosure surface aside from the bottom ortop of the enclosed volume) may be at least 90% information technologyrack surface, at least 95% information technology rack surface, at least98% information technology rack surface, or at least 99% informationtechnology rack surface.

In some examples, a floor and/or a ceiling may enclose the verticalcolumn of space and/or define the vertical column of space enclosed by aheat containment system. For example, the group of informationtechnology racks may extend from a floor to a ceiling such that thevertical column of space defined by the group of information technologyracks in enclosed by the floor and the ceiling. In some examples, aswill be discussed in greater detail below, the floor and/or ceiling mayhave one or more apertures. For example, one or more fans under thefloor (or composing portions of the floor) may blow air upward in thecontained area. Additionally or alternatively, one or more fanspositioned above the contained area may draw air within the containedarea upward. In some examples, an air return in the ceiling may directthe heated air out of the enclosure (e.g., to outside the data centerand/or to a cooling system). Additionally or alternatively, the airreturn may divert the heated air to mix with air from the outside (e.g.,cold air) to produce air of a desired temperature. In some examples, thetop of the heat containment system may be coupled to and/or feed into anair return apparatus.

In some embodiments, the group of information technology racks may takein air from the exterior faces of the group of information technologyracks. The air taken in may be cooler than the heated air ventilated bythe interior faces of the group of information technology racks. UsingFIG. 3 as an example, air in space 320 may be relatively cool (e.g.,cooled by a cooling system and/or simply unheated) and may be taken inthrough the exterior faces of the six information technology racks ofheat containment system 200. Likewise, using FIG. 5 as an example, airin space 520 may be cooler than air in space 510 and may be taken inthrough exterior faces of the twelve information technology racks ofheat containment system 400.

In some examples, the data center heat containment system may include anair flow apparatus adapted to move the heated air upward within thevertical column of space enclosed by the group of information technologyracks. The air flow apparatus may include any of a variety of elements.For example, FIG. 6 illustrates heat containment system 200 and a fan610 positioned at the base of heat containment system 200 to blow theheated air upward.

FIG. 7 illustrates multiple fans positioned within heat containmentsystem 200. As shown in FIG. 7, fans 712, 714, 716, 718, 720, and 722may be positioned to create a vortex 730 of air with an updraft withinthe vertical column of space. In this manner, heat containment system200 may quickly and efficiently facilitate the circulation of heated airto an air return.

FIG. 8 illustrates a cone 820 placed on base 302 of the interior of heatcontainment system 200. In some examples, a conical surface pointingupward within the vertical column of space, such as that provided bycone 820, may facilitate an updraft of the heated air.

FIG. 9 illustrates a liquid cooling pipe 910 extending vertically frombase 302 of the interior of heat containment system 200. Liquid coolingpipe 910 may transport heat away from the group of informationtechnology racks. For example, a liquid cooling system engaged withand/or integrated within one or more of the group of informationtechnology racks may transport heat to liquid cooling pipe 910. Liquidcooling pipe 910 may then transport the heat away from the group ofinformation technology racks. In some examples, liquid cooling pipe 910may, in addition to directly transporting heat away from the group ofinformation technology racks via the liquid cooling system, alsofacilitate an updraft of the heated air within heat containment system200 (e.g., to an air return).

In some examples, the group of information technology racks and/or theinformation technology device modules stored within the group ofinformation technology racks may be configured to contribute to anupdraft within the vertical column of space defined by the group ofinformation technology racks. For example, the information technologydevice modules may ventilate the heated air upward from the interiorfaces of the plurality of information technology racks (e.g., via ventopenings that direct the heated air upward and/or via an orientation ofthe information technology device modules that directs ventilation ofheated air upward). In various examples, the information technologydevice modules may ventilate the heated air with an upward component,but not directly upward. For example, the information technology devicemodules may ventilate the heated air at least 20 degrees upward from thebase of the heat containment system, at least 30 degrees upward, atleast 45 degrees upward, or at least 60 degrees upward. In someexamples, the information technology device modules may ventilate theheated air at a horizontal bias (e.g., relative to the normal of theface of the information technology devices modules and/or the respectiveinformation technology racks storing the information technology devicemodules) such that the ventilated air creates an updraft (e.g., bycreating a vortex with an updraft). For example, instead of ventilatingthe heated air directly toward the center of the hot air containmentarea, one or more of the information technology device modules mayventilate the heated air at a tangent of a circle around the center ofthe hot air containment area, thereby creating and/or contributing to avortex of air.

In some examples, the air flow apparatus may remove heated air from theheat containment system by creating a pressure differential between theair within the heat containment system and the air in a connected area.For example, a duct system may convey the heated air out of the heatcontainment system and to an area for the disposal of heated air (e.g.,to the exterior of a data center, to an air cooling system, etc.).Accordingly, the air flow apparatus may include one or more pumps and/orfans that reduce the air pressure in the duct system, thereby drawingthe heated air from the area within the heat containment system.

FIG. 10 illustrates a gantry robot 1000. The term “gantry,” as usedherein, may refer to any rigid structure adapted to provide movement foran operative assembly across an area defined by the rigid structure.Accordingly, the term “gantry robot,” as used herein, may refer to anygantry adapted to provide such movement for an operative assembly toperform programmable, automated tasks. For example, gantry robot 1000may be adapted to move a sliding element 1020 parallel to the face of aninformation technology rack that exposes information technology devicesthat are stored by the information technology rack and that therebyconnect to and operate within a computing infrastructure. As usedherein, the term “computing infrastructure” may refer to any collectionof devices and/or components that may collectively provide computationalresources. A computing infrastructure with modular components may beused in any of a variety of contexts. In some examples, a computinginfrastructure may provide computation in a cloud computing environment.Additionally or alternatively, a computing infrastructure may providecomputation in a parallel computing environment. In some examples, acomputing infrastructure may represent a collection of underlyingphysical computing resources that may be allocated and/or virtualized toprovide one or more logical and/or virtual computing resources.

In one example, a motor 1030 may drive sliding element along a frame1010 of gantry robot 1000. For example, motor 1030 may drive a pulley1040 to move sliding element 1020 up or down frame 1010 of gantry robot1000.

In some examples, a track may be coupled to sliding element 1020. Thetrack may extend away from sliding element 1020 and toward the face ofthe information technology rack. For example, sliding element 1020 maysupport one or more trays, including a tray 1050. In this example, tray1050 may include a track (e.g., on the underside of tray 1050, notvisible in FIG. 10) that runs perpendicular to sliding element 1020.Thus, the track may be coupled to sliding element 1020 via tray 1050.

As will be explained in greater detail below, gantry robot 1000 may alsoinclude an engaging element (e.g., on the underside of tray 1050, notvisible in FIG. 10) that is adapted to move along the track and toengage with one or more of the information technology device modulesstored by the information technology rack, such that the engagingelement is adapted to insert into the information rack and remove fromthe information technology rack one or more of the informationtechnology device modules.

As shown in FIG. 10, gantry robot 1000 may additionally include a powerconduit 1060 that may convey power to the engaging element (e.g., viasliding element 1020 and/or tray 1050) to enable the engaging element tomove along the track and/or engage with one or more informationtechnology device modules.

Gantry robot 1000 may remove or insert an information technology devicemodule in any of a variety of contexts. For example, gantry robot 1000may remove an information technology device module from an informationtechnology rack in response to a signal from the information technologyrack that the information technology device module is to be removed(e.g., a signal indicating that the information technology device moduleis defective). Likewise, gantry robot 1000 may insert an informationtechnology device module into an information technology rack in responseto a signal from the information technology rack that a slot within theinformation technology rack is available. In some examples, gantry robot1000 may receive instructions to insert, remove, move, and/or replacemodules from a data center coordination system that maintains a map ofinformation technology device modules and information technology rackswithin a data center.

FIG. 11 shows the underside of a tray 1100 (e.g., corresponding to tray1050 depicted in FIG. 10). As shown in FIG. 11, tray 1100 may include atrack 1110, a track 1120, and a track 1130, along which may slideengaging elements 1112, 1122, and 1132, respectively. In one example,each track may include multiple rails (e.g., that run throughcorresponding channels in the engaging elements).

FIG. 12 shows gantry robot 1000 positioned in front of informationtechnology rack 100. As seen in FIG. 12, gantry robot 1000 may bepositioned in front of information technology rack 100 such that the sixtrays of gantry robot 1000 are aligned with information technology rack100. In this manner, gantry robot 1000 may be able to access multipleinformation technology device modules at one time. For example, each ofthe trays 1100 may have three tracks (e.g., as shown in FIG. 11), eachwith an engaging element. Accordingly, the six trays may collectivelyinclude 18 tracks. While some examples discussed herein show a gantryrobot with six trays, each with three tracks, it may be appreciated thatother configurations may be employed. Generally, any suitable number oftrays may be coupled to the sliding element of a single gantry robot,and a tray may include multiple tracks carrying multiple engagingelements. By way of additional examples, the gantry robot may use asingle tray with three tracks, a single tray with six tracks, threetrays each with three tracks, nine trays each with two tracks, or threetrays each with six tracks. Thus, in various examples, gantry robot 1000may deploy an entire row of modules (e.g., 18 modules) at once.Additionally or alternatively, gantry robot 1000 may selectively deployand/or remove modules to or from any of the 18 corresponding slots at agiven position for sliding element 1020. In this manner, systemsdescribed herein may rapidly deploy, reconfigure, replace, and/or removetargeted modules in data center racks.

FIGS. 13-14 show gantry robot 1000 on a track system 1310 in base 302 ofheat containment system 200. In some examples, gantry robot 1000 may beadapted to travel along track system 1310 such that gantry robot 1000can travel from one information technology rack to another. For example,track system 1310 may provide a hub-and-spoke system whereby the leftleg of gantry robot 1000 can swing toward the hub, allowing gantry robot1000 to travel to a target information technology rack (e.g., with rightother leg) and then to swing the left leg toward the target informationtechnology rack.

FIG. 15 shows a gantry robot 1500. As shown in FIG. 15, gantry robot1500 may include a pole 1510 and tray 1100. In some examples, gantryrobot 1500 may be adapted to swivel around pole 1510. For example, FIG.16 illustrates gantry robot 1500 within the enclosure of heatcontainment system 400. As shown in FIG. 16, gantry robot 1500 mayswivel around an axis rising along the vertical column of space withinheat containment system 400. Gantry robot 1500 may thereby swivel toface a selected information technology rack and then engage with theselected information technology rack.

While the foregoing discussion provides examples of a single gantryrobot operating within a heat containment system, in some examplesmultiple robots may operate within a heat containment system. In someexamples, the disparate robots may be adapted to remove and/or installdifferent types of information technology device modules (e.g., thedisparate robots may be differently tooled, providing the ability tointerface with and/or grasp differently shaped information technologydevice modules). Additionally or alternatively, multiple robots mayperform tasks simultaneously and/or may provide operative redundancyshould one of the robots fail.

A method for manufacturing, assembling, using, adjusting, or otherwiseconfiguring or creating the systems described herein may includepositioning a group of information technology racks such that (1) eachrack within the group of information technology racks stores informationtechnology device modules, (2) interior faces of the group ofinformation technology racks define a vertical column of space enclosedby the group of information technology racks, and (3) the group ofinformation technology racks ventilate air heated by the informationtechnology device modules from the interior faces of the group ofinformation technology racks into the vertical column of space such thatthe heated air is contained within the vertical column of space. UsingFIGS. 2 and 3 as an example, racks 210, 212, 214, 216, 218, and 220 maybe positioned such that racks 210, 212, 214, 216, 218, and 220 definespace 310 enclosed by the racks and such that racks 210, 212, 214, 216,218, and 220 ventilate air heated by the information technology devicemodules stored in the racks from the interior faces of the racks suchthat the heated air is contained within space 310. In some examples, thebase of the vertical column of space defined by the interior faces ofthe racks may approximate a circle (e.g., by approximating a regularpolygon, such as the hexagonal base 302).

In some examples, the group of information technology racks may becoupled together (e.g., with hinges, brackets, adhesive, etc.). In someexamples, a covering material (e.g., a shell spanning from the edge ofone information technology rack to the edge of an adjacent informationtechnology rack) may block air from escaping via any small cracksbetween the information technology racks.

As discussed throughout the instant disclosure, the disclosed methods,systems, and devices may provide one or more advantages over traditionaldata center configurations. By placing data center racks to createcomplete (or nearly complete) enclosures and orienting the data centerracks (and devices within the data center racks) to ventilate heated airinto the enclosures, the systems and methods described herein mayefficiently and effectively separate heated air from cool air withindata centers, thereby potentially reducing cooling equipment and energycosts. In addition, by creating complete enclosures from data centerracks themselves, these systems and methods may avoid costs that wouldotherwise be incurred by constructing separate walls, rooms, and/orextensions to contain heated air. In some examples, by arranging datacenter racks to create approximately circular enclosures, these systemsand methods may reduce diffusion of heat from the enclosures to theouter environment and/or may improve air flow dynamics to quickly moveheated air toward an air return with little additional energy input.Additionally or alternatively, one or more air flow apparatusesoperating in connection with the data center racks may improve air flowdynamics to facilitate hot air return.

The preceding description has been provided to enable others skilled inthe art to best utilize various aspects of the exemplary embodimentsdisclosed herein. This exemplary description is not intended to beexhaustive or to be limited to any precise form disclosed. Manymodifications and variations are possible without departing from thespirit and scope of the instant disclosure. The embodiments disclosedherein should be considered in all respects illustrative and notrestrictive. Reference should be made to the appended claims and theirequivalents in determining the scope of the instant disclosure.

Unless otherwise noted, the terms “connected to” and “coupled to” (andtheir derivatives), as used in the specification and claims, are to beconstrued as permitting both direct and indirect (i.e., via otherelements or components) connection. In addition, the terms “a” or “an,”as used in the specification and claims, are to be construed as meaning“at least one of.” Finally, for ease of use, the terms “including” and“having” (and their derivatives), as used in the specification andclaims, are interchangeable with and have the same meaning as the word“comprising.”

1.-20. (canceled)
 21. A system comprising: a plurality of informationtechnology racks arranged such that a vertical column of space isenclosed by the plurality of information technology racks; a gantryrobot positioned within the vertical column of space; and a floor tracksystem including a hub, the gantry robot engaged in the floor tracksystem and adapted to travel from a position in front of an interiorface of a first information technology rack to a position in front of aninterior face of a second information technology rack, the travelincluding: swinging a first leg of the gantry robot towards the hub,allowing a second leg of the gantry robot to travel from the position infront of the interior face of the first information technology rack tothe position in front of the interior face of the second informationtechnology rack; and subsequent to swinging the first leg of the gantryrobot towards the hub, swinging the first leg of the gantry robottowards the position in front of the interior face of the secondinformation technology rack.
 22. The system of claim 21, whereininterior faces of the plurality of information technology racks extendperpendicularly from a base of the plurality of information technologyracks.
 23. The system of claim 22, wherein the base approximates acircle; and wherein the floor track system is included in the base. 24.The system of claim 21, wherein interior faces of the plurality ofinformation technology racks extend obliquely away from a center of theplurality of information technology racks such that the vertical columnof space expands as a vertical distance from a base of the plurality ofinformation technology racks increases.
 25. The system of claim 21,wherein the gantry robot comprises a sliding element adapted to moveparallel to an interior face of an information technology rack.
 26. Thesystem of claim 25, wherein the gantry robot further comprises a trackthat is coupled to the sliding element and that extends away from thesliding element and toward the interior face of the informationtechnology rack.
 27. The system of claim 26, wherein each rack withinthe plurality of information technology racks stores a plurality ofinformation technology device modules.
 28. The system of claim 27,wherein the gantry robot further comprises an engaging element that isadapted to move along the track and to engage with one or more of theplurality of information technology device modules such that theengaging element inserts into an information technology rack and removesfrom the information technology rack one or more of the plurality ofinformation technology device modules included in the informationtechnology rack.
 29. The system of claim 21, wherein the plurality ofinformation technology racks extend from a floor to a ceiling such thatthe vertical column of space is further enclosed by the floor and theceiling.
 30. The system of claim 21, further comprising an air flowapparatus adapted to move air upward within the vertical column ofspace.
 31. A method comprising: positioning a plurality of informationtechnology racks such that a vertical column of space is enclosed by theplurality of information technology racks; positioning a gantry robotwithin the vertical column of space such that the gantry robot isengaged in a floor track system; swinging a first leg of the gantryrobot towards a hub included in the floor track system, the swingingallowing a second leg of the gantry robot to travel from a position infront of an interior face of a first information technology rack to aposition in front of an interior face of a second information technologyrack; and subsequent to swinging the first leg of the gantry robottowards the hub, swinging the first leg of the gantry robot towards theposition in front of the interior face of the second informationtechnology rack.
 32. The method of claim 31, wherein interior faces ofthe plurality of information technology racks extend perpendicularlyfrom a base of the plurality of information technology racks.
 33. Themethod of claim 32, wherein the base approximates a circle; and whereinthe floor track system is included in the base.
 34. The method of claim31, wherein interior faces of the plurality of information technologyracks extend obliquely away from a center of the plurality ofinformation technology racks such that the vertical column of spaceexpands as a vertical distance from a base of the plurality ofinformation technology racks increases.
 35. The method of claim 31,wherein the gantry robot comprises a sliding element adapted to moveparallel to an interior face of an information technology rack.
 36. Themethod of claim 35, wherein the gantry robot further comprises a trackthat is coupled to the sliding element and that extends away from thesliding element and toward the interior face of the informationtechnology rack.
 37. The method of claim 36, wherein each rack withinthe plurality of information technology racks stores a plurality ofinformation technology device modules.
 38. The method of claim 37,wherein the gantry robot further comprises an engaging element that isadapted to move along the track and to engage with one or more of theplurality of information technology device modules stored by theinformation technology rack.
 39. The method of claim 38, wherein themethod further comprises removing an information technology devicemodule from the information technology rack by inserting the engagingelement into the information technology rack, the inserting engagingwith the information technology device module.
 40. The method of claim31, further comprising moving air upward within the vertical column ofspace, the movement ventilating air from interior faces of the pluralityof information technology racks.